Publish Time: 2021-01-05 Origin: Site
Many devices in communication products consume large amounts of power and require aluminum heat sinks for heat dissipation. Commonly used heat sink fixing methods include mechanical fixing and adhesive fixing.
Common design failures mainly include the adhesive custom heat sink falling off, the screw mounting the heat sink causes the PCB board to bend and even causes the device to fail, especially the BGA solder joint failure.
Shengyida is the leading custom heat sink manufacturer, the following describes the design requirements of the heat sink installation method:
(1) The heat sink should be fixed mechanically, and flexible installation should be adopted. It is strictly forbidden to use inelastic screws to fix.
(2) It is not recommended that multiple chips share a heat sink, especially BGA chips, which will fall freely during soldering, and the height from the PCB surface is difficult to control. Therefore, when multiple chips share a heat sink, the heat sink should be installed and fixed. Only the design of thermally conductive rubber pad plus heat sink and mechanically fixed can be used, but this design often causes the BGA solder joints to squash or break due to the installation sequence of the screws during installation.
(3) Adhesive process should be adopted, the matching of the adhesive area and the quality of the heat sink and the wettability of the adhesive and the surface of the heat sink should be considered (for example, some glues are not wetted with Ni plating), otherwise, they will easily fall off.